Becoming a leader in the global semiconductor heterojunction integration field

Semiconductor heterogeneous integration technology enterprise iSABers Semiconductor Technology Co., Ltd. (hereinafter referred to as "iSABers" or "the Company") announced the completion of its latest round of financing

In today’s era of rapid global technological advancement, the importance of chips cannot be overstated. One of the core technologies supporting this progress is semiconductor substrate materials. As one of the few semiconductor companies globally to master the full suite of advanced semiconductor materials and heterogeneous integration technologies, iSABers has set a new benchmark in the field of composite semiconductor substrate materials.

As a leading enterprise in the field of semiconductor heterogeneous integration technology, iSABers Semiconductor Technology Co., Ltd. recently announced the successful development of an 8-inch Obsidian-Piezoelectric on Insulator (Obsidian-POI) substrate for high-performance filters. This achievement not only highlights iSABers’ profound expertise in advanced semiconductor material heterogeneous integration but also propels China’s technological capabilities in this field to the international forefront .

From April 24 to 26, 2024, the 4th Academic Conference on Heterogeneous Material Welding and Bonding, jointly organized by Harbin Institute of Technology and other institutions, was grandly held in Chongqing. Mr. Tan Xianghu, Deputy General Manager of Beijing iSABers Semiconductor Technology Co., Ltd., was invited to attend the conference and delivered an invited keynote speech titled "Advanced Semiconductor Bonding Integration Technology and Applications".

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Compared to 6-inch SiC wafers, 8-inch SiC wafers offer nearly double the usable area, increasing chip yield by 80-90%. This upgrade to 8-inch SiC wafers will bring significant benefits to automotive and industrial customers, making the transition to 8-inch technology a recognized industry trend. However, SiC crystal growth faces bottlenecks such as low yield rates and long growth cycles, which hinder effective cost reduction. Advanced SiC bonded substrate technology addresses this by integrating high-quality and low-quality SiC substrates through bonding, efficiently utilizing low-quality growth substrates. Combined with crystal growth advancements, this technology significantly reduces SiC material costs and transforms excess traditional productivity into new quality productivity.

From November 27 to 30, 2023, the 9th International Third-Generation Semiconductor Forum (IFWS) & 20th China International Semiconductor Lighting Conference (SSLCHINA) was grandly held at the Xiamen International Conference Center. Beijing iSABers Semiconductor Technology Co., Ltd. (iSABers) was invited to participate as an exhibitor and was awarded the "Brand Power" honorary award. As an annual grand event for the third-generation semiconductor industry in China, IFWS & SSLCHINA is a forward-looking, global, and high-level comprehensive forum. This year’s conference focused on third-generation semiconductor technologies and applications, exploring development trends and opportunities under the new industry landscape. Topics included wide bandgap semiconductor materials (SiC, GaN), advanced packaging technologies, and applications in new energy vehicles, 5G communications, and intelligent manufacturing.

Recently, the Beijing Municipal Bureau of Economy and Information Technology announced the list of Beijing’s SRUI small and medium-sized enterprises (SMEs) for Q3 2023. Beijing iSABers Semiconductor Technology Co., Ltd. was successfully included, awarded the title of Beijing "Specialized, Refined, Unique, and Innovative" SME.

On October 26, the finals of the 2nd National Postdoctoral Innovation and Entrepreneurship Competition, themed "Intellectual Convergence Empowers Development, Postdoctoral Innovation Leads the Future," was grandly held in Yantai, Shandong Province. Dr. Mu Fengwen, General Manager of iSABers Group, led his team to participate and won the Gold Award in the High-End Manufacturing Category of the Entrepreneurship Competition with their project "Surface-Activated Wafer Bonding Technology."

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Recently, the Tianjin Municipal Science and Technology Bureau announced the "Tianjin 2023 Sixth Batch of Draft List for Young Eagle Enterprises, Gazelle Enterprises, and Technology Leading (Cultivation) Enterprises". Among them, Tianjin Zhongke Jinghe Electronics Technology Co., Ltd. was successfully selected into the Tianjin Gazelle Enterprises list.