Semiconductor heterogeneous integration technology enterprise iSABers Semiconductor Technology Co., Ltd. (hereinafter referred to as "iSABers" or "the Company") announced the completion of its latest round of financing, raising over 300 million yuan. Investors include Shenzhen Capital Group (SCG), Yuanzhi Xinghuo (a venture capital firm), Chipown Microelectronics, with existing shareholders Zhengwei Capital, Xinkeyuan, and Tianchuang Capital also participating in this round.

The funds will be allocated to the construction of advanced bonding equipment and bonded substrate production lines. iSABers plans to further expand its production scale, increasing the annual capacity of advanced bonding equipment to 60 units (sets) to meet growing customer demand. Additionally, a new 400,000 8-inch SiC bonded substrate production line will be established to accelerate mass production of 8-inch SiC substrates, further consolidating iSABers’ leading position in China’s bonding integration technology sector.

As one of the few semiconductor companies globally to master the full suite of advanced semiconductor materials and heterogeneous integration technologies, iSABers is committed to providing cutting-edge solutions for wafer-level material heterogeneous integration, advanced packaging, and ultra-precision processing. The Company has already completed R&D and mass production of multiple bonded substrate materials (e.g., SiC, LTOI, LNOI) and high-end wafer bonding equipment.

Looking ahead, iSABers will remain steadfast in its focus on independent technological R&D, accelerating the transformation and application of scientific achievements to achieve seamless integration and efficient fusion of new quality productive forces and new quality combat effectiveness. The Company aims to become a global leader in semiconductor heterogeneous integration, contributing significantly to the growth of China’s semiconductor industry.