As one of the few global semiconductor companies mastering the full suite of advanced semiconductor substrate bonding integration technologies, iSABers Group is committed to industrializing cutting-edge semiconductor material integration technologies in China.

Sunlight leisurely running without interruption Walking towards the sun and following the light all the way Qinghe Shengyi runs at the right time ......

To thank our friends for their hard work and dedication On the occasion of the Dragon Boat Festival, the company has carefully prepared heartwarming benefits for the festival, delivering warm and caring gifts to every Qinghe person

With a focus on strategic development and building a learning organization, iSABers Group is committed to cultivating multi-skilled composite talent and encouraging employees to continuously learn and improve work efficiency. The company organized a staff skill assessment at its Optoelectronics Park facility on May 29, followed by the issuance of skill assessment certificates on June 16. The initiative aims to recognize employees who demonstrate professional operation capabilities and self-improvement in their work.

iSABers focuses on innovation and breakthroughs in semiconductor bonding technology. Our core business encompasses not only the R&D and manufacturing of high-end bonding equipment but also precision bonding process OEM services.

"Currently, the domestic market demand for advanced semiconductor composite substrate materials, particularly silicon carbide (SiC), far exceeds supply. Major application sectors include new energy vehicles, photovoltaics, and power transmission," according to industry insights. The first-phase production capacity of this line is 30,000 wafers, with plans to expand to 150,000 wafers in the future. Substrate sizes primarily focus on 6 inches, with a roadmap to transition to 8 inches.

On May 19, 2023, the "Integrate Innovation, Break Boundaries" commissioning ceremony for iSABers’ Tianjin new bonding-integrated substrate mass production demonstration line was successfully held in Binhai High-Tech Zone! This milestone signifies China’s strategic breakthrough in the fiercely competitive global semiconductor market, carrying significant implications for promoting high-quality development of China’s semiconductor industry, filling domestic market gaps, and strengthening independent innovation capabilities. The event attracted leaders and experts from government, industry, academia, research, and investment sectors, who jointly witnessed this major industry occasion.

In order to strengthen breakthroughs in semiconductor materials and device technology and promote the leapfrog development of domestic semiconductor technology, on May 19, 2023

3月11日，青禾晶元在香港隆重举办新品发布会，全球首台独立研发C2W & W2W双模式混合键合设备SAB 82CWW系列震撼亮相！发布会汇聚半导体行业顶尖专家、学者及媒体，共同见证这一颠覆性技术的诞生。表面活化键合技术之父，混合键合技术的首次提出者须贺唯知教授也莅临发布会现场。青禾晶元作为先进封装领域的核心参与者与推动者，以创新实力再次证明其行业引领地位。

Hosted by Beijing iSABers Semiconductor Technology Co., Ltd., the "Interconnection Technology Symposium" will take place in Tianjin Binhai New Area on May 17. The forum aims to strengthen exchanges in semiconductor interconnection technologies and promote leapfrog breakthroughs in domestic semiconductor technology.

The Beijing Science and Technology Star Program is a science and technology talent cultivation initiative supported by Beijing municipal fiscal funds and implemented by the Beijing Municipal Science and Technology Commission. It aims to identify outstanding young scientific and technological backbones, carry out technological innovation through project-based initiatives, enhance research capabilities and management skills, and cultivate a group of young scientific and technological leaders with high political integrity, strong innovation capabilities, and a spirit of innovation.

On December 23rd, the first equipment moving-in and launch ceremony for iSABers' Tianjin Composite Substrate Mass Production Demonstration Line— a leading enterprise in semiconductor heterogeneous integration technology— was successfully held at the Binhai High-tech Zone's Bolonghu Science and Technology Park in Tianjin. Xia Qinglin, Secretary of the Party Committee and Director of the Management Committee of Tianjin Binhai High-tech Zone; Dr. Mu Fengwen, Chairman of iSABers; Luo Longfei, Executive General Manager of China International Capital Corporation (CICC); Zhou Quan, Partner of Shenzhen InnoFortune Fund Management Co., Ltd.; Yang Bo, Partner of Shanghai Weihao Chuangxin Investment Management Co., Ltd.; and Li Yong, Partner of Deheng Law Offices, attended the ceremony.