The SAB6100 is an R&D-grade bonding system designed for semiconductor and heterogeneous material integration.Utilizing room-temperature UHV bonding technology, it enables atomic-level surface activation and direct covalent bonding without heating. The system accommodates full-wafer and custom-shaped substrates, supports optional dedicated deposition chambers, and ensures process stability and repeatability.

The SAB6110 is a high-throughput bonding system designed for semiconductor and heterogeneous material integration. Utilizing room-temperature UHV bonding technology, it enables atomic-level surface activation and direct covalent bonding without heating. Featuring automated handling, a dedicated deposition chamber, and precision alignment, it ensures process stability with full-wafer compatibility.

The SAB6110 CST is a high-volume production system for semiconductor and heterogeneous material bonding, featuring a multi-chamber cluster design. It integrates activation, baking, sputtering (ion beam/magnetron), alignment, and bonding functions. Each chamber has independent dry and molecular pumps for rapid vacuum pumping. The activation module efficiently removes surface oxides, while the baking module rapidly eliminates moisture. It supports edge/Mark alignment, cassette automated loading, and meets high-volume production demands.