The SAB6100 is an R&D-grade bonding system designed for semiconductor and heterogeneous material integration.Utilizing room-temperature UHV bonding technology, it enables atomic-level surface activation and direct covalent bonding without heating. The system accommodates full-size and custom-shaped wafers, supports optional dedicated deposition chamber, and ensures process stability and repeatability.

The SAB6110 is a high-throughput bonding system designed for semiconductor and heterogeneous material integration. Utilizing room-temperature UHV bonding technology, it enables atomic-level surface activation and direct covalent bonding without heating. It supports full-size compatibility and is equipped with automated wafer loading, independent deposition chamber, and high-precision alignment system, delivering stable processes and high-throughput production.

The SAB6110 CST is a high-throughput production system for semiconductor and heterogeneous material bonding, featuring a multi-chamber cluster design. It integrates activation, baking, sputtering (ion beam/magnetron), alignment, and bonding functions. Each chamber has independent dry and molecular pumps for rapid vacuum pumping. The activation module efficiently removes surface oxides, while the baking module rapidly eliminates moisture. It supports edge/mark alignment, cassette automated loading, and meets high-throughput production demands.