From April 24 to 26, 2024, the 4th Academic Conference on Heterogeneous Material Welding and Bonding, jointly organized by Harbin Institute of Technology and other institutions, was grandly held in Chongqing. Mr. Tan Xianghu, Deputy General Manager of Beijing iSABers Semiconductor Technology Co., Ltd., was invited to attend the conference and delivered an invited keynote speech titled "Advanced Semiconductor Bonding Integration Technology and Applications".

With the development of semiconductor industry technologies, bonding technology has become increasingly critical, particularly in advanced bonding techniques that are indispensable in numerous semiconductor manufacturing processes. As one of the few global semiconductor companies mastering the full suite of advanced semiconductor material and device integration technologies, iSABers has completed R&D and mass production of various bonded substrate materials such as SiC, LTOI (Lithium Tantalate on Insulator), and LNOI (Lithium Niobate on Insulator), as well as the development of high-end wafer bonding equipment.