Headquarters relocated to Tianjin Hi-Tech Industrial Park, rebranded as iSABers Group Co., Ltd.

Unveiled the world’s first independently developed dual-mode C2W&W2W SAB8210CWW equipment.

Phase II production line of the Heterogeneous Integration Equipment Division commenced operations, with annual capacity exceeding 100 units.

Achieved mass sales of bonding equipment, with annual orders exceeding ¥300 million.

Released 8-inch LTOI/LNOI and 6-inch SiCOI composite substrates, marking international market breakthroughs.

Made significant progress in 6-8-inch SiC composite substrates, with results published at IEDM (IEEE International Electron Devices Meeting).

Approved to establish a postdoctoral research workstation.

Honored as a 2024 National High-Tech Enterprise.

Undertook a major National Natural Science Foundation research instrument project.

Closed B+ and B++ funding rounds, raising over ¥200 million.

Launched the SAB 82 and SAB 62HB series of high-precision hybrid bonding equipment, advancing Chiplet packaging and other cutting-edge services.

Unveiled the SAB 95 ultra-atomic beam equipment, entering atomic-level manufacturing.

Commissioned the Tianjin SiC bonded substrate production line.

Recognized as a provincial-level "Specialized, Refined, Unique, Innovative" (SRUI) enterprise.

Awarded the Gold Prize at the National Postdoctoral Innovation & Entrepreneurship Competition.

Completed Series B funding, raising over ¥200 million.

Introduced multiple high-end bonding equipment series, including SAB 83, SAB 63, and SAB 64.

Debuted 6-inch advanced composite substrate materials (e.g., LTOI, LNOI).

Acquired a Japanese room-temperature bonding equipment company to expand overseas operations.

Closed A+ and A++ funding rounds, raising over ¥300 million.

Launched the Bonded Substrate Materials Division, initiating R&D on advanced composite substrates.

Delivered China’s first room-temperature bonding equipment, filling a domestic industry gap.

Completed Pre-A and Pre-A+ funding rounds, raising nearly ¥200 million.

iSABers Group parent company was established, alongside the founding of the Heterogeneous Integration Equipment Division.

Secured angel-round funding.