The SAB6100 is an R&D-grade bonding system designed for semiconductor and heterogeneous material integration.By UHV bonding technology, it enables atomic-level surface activation and direct covalent bonding at room temperature. The system accommodates both standard size and custom-shaped wafers, enables the deposition of nanoscale films, and enhances bonding strength.

The SAB6110 is a high-throughput bonding system designed for semiconductor and heterogeneous material integration. By utilizing UHV bonding technology, it enables atomic-level surface activation and direct covalent bonding at room temperature. All standard-sized wafers are compatible. This equipment is equipped with automated wafer loading module, independent deposition chamber and high-precision alignment system, delivering stable processes and high-throughput.

The SAB6110 CST is a high-throughput production system for semiconductor and heterogeneous material bonding, featuring a multi-chamber cluster design, which integrates activation, baking, sputtering (ion beam/magnetron), alignment, and bonding functions. Each chamber equipped independent dry and molecular pumps for rapid vacuum pumping. The activation module efficiently removes surface oxides, while the baking module rapidly eliminates moisture. It supports edge/mark alignment modes. This equipment is compatible with automatic loading and unloading cassettes, meeting the requirements of high-efficiency mass production.

The SAB6210 is a hydrophilic fusion bonding system that utilizes plasma treatment and spin-rinse drying to enrich wafer surfaces with -OH groups, enabling alignment and bonding at room temperature in either atmosphere or vacuum.

The SAB6210HB is a hybrid bonding system designed for wafers with patterned dishing Cu pads and dielectric materials (e.g., SiO₂ or SiCN). It enriches -OH groups on dielectric surfaces via plasma treatment and water rinse/spin-drying, enabling high-precision alignment (via MARK) and bonding in ambient atmosphere.

The SAB6300 is a versatile, semi-automatic bonding system for R&D and small-batch production. It supports thermocompression bonding and anodic bonding, enabling diffusion bonding of metals (Au, Cu, Al, etc.), eutectic materials (Au-Sn, Al-Ge, etc.), or adhesives through precise temperature and pressure control. It also achieves glass-to-silicon bonding via electrostatic field application combined with heating and pressurization.

The SAB6310 is a fully automated bonding system compatible with thermocompression and anodic bonding. It integrates plasma activation, cleaning, alignment, and bonding modules for high-quality, high-throughput production.

The SAB6410TB is a fully automated temporary bonding system integrating spin coating, baking, alignment, and bonding functions. It bonds two wafers with adhesives to enable backside processing of device wafers.

The SAB6410DB is a fully automated debonding system that performs debonding through mechanical, thermal-sliding, or laser-scanning methods, ensuring zero damage to wafers, temporary carriers, and patterned layers. Post-debonding cleaning (chemical or plasma) guarantees residue-free surfaces with no adhesive remnants, watermarks, carbon ash, or other contaminants.

The SAB8210CW is a fully automated C2W hybrid bonding system. It supports C2W hybrid bonding with patterned chips to achieve high-density Cu-Cu interconnects, as well as C2W hydrophilic bonding with unpatterned bare dies to form reconstituted wafers for subsequent die patterning.

The SAB8210CWW is a fully automated hybrid bonding system integrating C2W (Chip-to-Wafer) and W2W (Wafer-to-Wafer) dual modes. It supports 8/12-inch wafers and handles ultra-thin chips (down to 35μm) of various sizes. The system enables parallel development and validation of C2W and W2W processes, significantly shortening the R&D-to-production transition timeline.

The SAB8300C2C is a semi-automatic flip-chip bonding system designed for R&D, sample validation, and small-batch production. It enables high-precision alignment and reliable interconnects between micro-bumps and pads in an inert gas or hydrogen radical environment.

The SAB8310CW is a fully automated C2W flip-chip (alignment&thermocompression) bonding system for high-volume production. It supports automatic wafer/chip loading/unloading, and independent hydrogen radical and plasma activation chambers for high-quality fluxless TCB bonding.

The SAB961X is a fully automated Super-atoms Beam surface TRIM system with cassette-based loading/unloading, suitable for high-volume production for semiconductor film TRIM.