The SAB6300 is a versatile, semi-automatic bonding system for R&D and small-batch production. It supports thermocompression bonding and anodic bonding, enabling diffusion bonding of metals (Au, Cu, Al, etc.), eutectic materials (Au-Sn, Al-Ge, etc.), or adhesives through precise temperature and pressure control. It also achieves glass-to-silicon bonding via electrostatic field application combined with heating and pressurization.

The SAB6310 is a fully automated bonding system compatible with thermocompression and anodic bonding. It integrates plasma activation, cleaning, alignment, and bonding modules for high-quality, high-throughput production.