The SAB8210CW is a fully automated C2W hybrid bonding system. It supports C2W hybrid bonding with patterned chips to achieve high-density Cu-Cu interconnects, as well as C2W hydrophilic bonding with unpatterned bare dies to form reconstituted wafers for subsequent die patterning.

The SAB8210CWW is a fully automated hybrid bonding system integrating C2W (Chip-to-Wafer) and W2W (Wafer-to-Wafer) dual modes. It supports 8/12-inch wafers and handles ultra-thin chips (down to 35μm) of various sizes. The system enables parallel development and validation of C2W and W2W processes, significantly shortening the R&D-to-production transition timeline.