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- 2024-11-15
- iSABers News | Dr. Mu Fengwen, Founder and Chairman of iSABers, Invited to Deliver Keynote Speech at IFWS & SSLCHINA 2024
The 10th International Third Generation Semiconductor Forum (IFSW2024) and the 21st China International Semiconductor Lighting Forum (SSLCHINA2024) Advanced Semiconductor Technology Application Innovation Exhibition (CASTAS)
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- 2024-11-12
- iSABers Talent | Return to Alma Mater, Build Dreams for the Future – iSABers 2025 Tsinghua University Campus Recruitment Talk
Dr. Mu Fengwen, founder and chairman of iSABers Group. Master's degree in Mechanical Engineering from Tsinghua University, PhD from the University of Tokyo, former researcher at the Institute of Microelectronics, Chinese Academy of Sciences, national level overseas high-level talent, and member of the Tsinghua Entrepreneurs Association.
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- 2024-11-01
- iSABers News | iSABers Group Achieves Mass Delivery of High-End Wafer Bonding Equipment
On November 1, 2024, iSABers’ self-developed high-end wafer bonding equipment successfully passed customer acceptance and entered mass delivery phase.
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- 2024-10-21
- iSABers News | October & November Exhibition Compilation of iSABers
October & November Exhibition Compilation of iSABers
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- 2024-10-19
- iSABers News | Oct 20-23, iSABers Meets You at the International Conference on Hard Brazing, Diffusion Bonding and Micro-Nano Bonding
iSABers Semiconductor Technology (Group) Co., Ltd. is a high-tech enterprise specializing in semiconductor bonding integration technology in China. Its core business covers R&D and manufacturing of high-end bonding equipment, as well as precision bonding process OEM services. The technologies are widely applied in cutting-edge fields such as advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration, and MEMS sensors. Through the dual-drive model of "equipment manufacturing + process services," the company builds full-industrial-chain solutions and has successfully developed four independent intellectual property product matrices: ultra-high vacuum room-temperature bonding systems, hybrid bonding equipment, thermocompression bonding equipment, and supporting process services. Through continuous technological innovation, iSABers is committed to providing the global semiconductor industry chain with high-precision, process-stable, and cost-effective bonding equipment and solutions to boost the rise of strategic emerging industries.
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- 2024-10-16
- iSABers News | Launch of iSABers Project Management Elite Training Camp: Empowering Elites for Growth
When the wind is strong, it’s time to set sail and forge ahead. From October 12 to 14, the iSABers Project Management Elite Training Camp officially kicked off in Tianjin Binhai New Area. Dr. Mu Fengwen, Chairman of iSABers Group, led over 50 ISABers to participate, and the first phase of training has been completed.
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- 2024-09-13
- As the Mid-Autumn Moon Nears Fullness, So Does the Warmth of This Season's Sentiments
Surprise activity - The top ten employees who answer the meaning of the custom pattern of the wooden carving lamp will receive a mysterious gift.
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- 2024-09-06
- iSABers News | Dr. Mu Fengwen, Chairman and General Manager, Invited to Deliver Academic Report at CY-56 Advanced Semiconductor Manufacturing Technology Sub-Conference
Dr. Mu Fengwen has long focused on the research and development of advanced heterogeneous integration technologies and equipment. He is proficient in the preparation of advanced compound semiconductor materials, low-cost device manufacturing, and the entire process of back-end packaging. As a national-level overseas high-level talent and a high-level talent from the Chinese Academy of Sciences (CAS) overseas program, Dr. Mu previously served as a researcher at the CAS Institute of Microelectronics.
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- 2024-09-03
- News | iSABers Approved for 2024 New Batch of Postdoctoral Research Workstation Branches
Recently, the Tianjin Municipal Human Resources and Social Security Bureau released the Notice on the 2024 New Batch of Postdoctoral Research Workstation Branches, in which Tianjin Zhongke Jinghe Electronic Technology Co., Ltd. (hereinafter referred to as "Zhongke Jinghe"), a subsidiary of iSABers Group, was approved for inclusion.
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- 2024-08-28
- iSABers Leads Innovation: Major Breakthrough in High-Quality Wafer-Level Silicon Carbide on Insulator (SiCOI) Preparation
Recently, iSABers, a leading Chinese enterprise in semiconductor material heterogeneous integration technology, announced a significant breakthrough in the preparation of silicon carbide on insulator (SiCOI) materials, successfully achieving mass production of high-quality wafer-level SiCOI (6-inch, SiC film thickness 1μm±100nm). This achievement not only marks a new height in iSABers’ R&D capabilities and technological innovation in semiconductor materials but also injects strong momentum into the development of China’s and the global semiconductor industry.
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- 2024-08-12
- Exhibition News | Zhongke Jinghe Participates in ICEPT 2024 International Conference on Electronic Packaging Technology
From August 7-9, 2024, the International Conference on Electronic Packaging Technology (ICEPT 2024) was held in Tianjin, China. Tianjin Zhongke Jinghe Electronics Technology Co., Ltd. (hereinafter referred to as "Zhongke Jinghe") served as a co-organizer and exhibitor at the event.
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- 2024-08-03
- Building Dreams through Public Welfare and Walking Together with Love
On August 3, 2024, the Tianjin "Jinchai Firefighting Accompanying Growth, Youth Building Dreams and Creating the Future" Hope Engineering Dream Practice Camp, donated by our company's love, officially opened. Guan Peng from our Strategic Planning and Policy Analysis Department attended the opening ceremony as a representative of the organizing unit.
This activity aims to organize eligible students to cultivate their safety awareness and self-protection ability through the popularization and practical experience of fire safety knowledge.