On October 26, the finals of the 2nd National Postdoctoral Innovation and Entrepreneurship Competition, themed "Intellectual Convergence Empowers Development, Postdoctoral Innovation Leads the Future," was grandly held in Yantai, Shandong Province. Dr. Mu Fengwen, General Manager of iSABers Group, led his team to participate and won the Gold Award in the High-End Manufacturing Category of the Entrepreneurship Competition with their project "Surface-Activated Wafer Bonding Technology."

As the largest, highest-level, and most comprehensive national competition for postdoctoral researchers since the implementation of China’s postdoctoral system, the event attracted 1,457 participating teams to the finals. The competition covered six major categories, including high-end manufacturing, new materials, and new generation information technology, showcasing cutting-edge innovations and entrepreneurial projects across multiple industries.

Project Highlights and Impact

Dr. Mu’s team’s Surface-Activated Wafer Bonding Technology fills a domestic gap in related fields, effectively addressing the "necklace" issues (critical technology bottlenecks) in China’s advanced semiconductor materials and key technologies. This technology enables atomic-level bonding of heterogeneous materials (e.g., silicon, silicon carbide, lithium niobate) at room temperature without adhesives, significantly improving the reliability and performance of semiconductor devices.

This translation balances achievement celebration with technical and strategic depth, suitable for press releases, academic award announcements, and government innovation reports.