Technological Advantages
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- Advanced Optical Alignment & Pressure Control Technologies
- Achieves micron-level bonding accuracy and supports interconnect pitches of 10–100 μm.
01
- Fluxless TCB Process Support
- Eliminates flux residue compared to conventional TCB, ensuring more reliable interconnects.
02
- Uniform Intermetallic Compound (IMC) Interface Formation
- Reduces voids and microcracks, ensuring excellent electrical conductivity, mechanical strength, and long-term reliability of bonding points.
03 -
- Enhanced Compatibility & Cost Efficiency
- Compared to hybrid bonding, this technology imposes lower requirements on chip design, surface quality, edge chipping, and particle contamination tolerance, while offering higher equipment compatibility and reduced capital investment.
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