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- 2025-05-01
- Pay tribute to the strivers in the semiconductor industry and wish you a happy May Day!
Pay tribute to the strivers in the semiconductor industry and wish you a happy May Day!
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- 2025-04-21
- iSABers Co-hosted – 2025 China International Seminar on Low-Temperature Bonding and 3D Integration Technology Invites You to Participate
Semiconductor bonding technology is driving revolutionary advancements in 3D integration and advanced packaging! As an innovation leader in low-temperature bonding and bonding integration, iSABers has joined forces with international authoritative institutions such as the Institute for Microsystems Integration (IMSI) of Japan to co-host the 2025 China International Low-Temperature Bonding and 3D Integration Technology Seminar (LTB-3D 2025). This globally top-tier academic conference will make its debut in China, bringing together numerous international giants and global experts to explore the frontiers of wafer bonding technology and its industrial applications.
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- 2025-03-21
- SEMICON In-Person Advanced Bonding Technology Breakthroughs Symposium
SEMICON In-Person Advanced Bonding Technology Breakthroughs Symposium
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- 2025-03-18
- SEMICON CHINA 2025 | iSABers Meets You in Shanghai
SEMICON CHINA 2025 | iSABers Meets You in Shanghai
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- 2025-03-05
- Preview | Global First, Independently Developed, Coming Soon with a Bang!
Global First, Independently Developed, Coming Soon with a Bang!
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- 2025-02-28
- iSABers Drives Micro-LED Industrialization with Advanced Bonding Technology
Recently, the 2025 6th Global Mini/Micro LED Display Technology Week was held in Xiamen, with the theme "MLED Empowering Full Scenarios of Vehicle, Home, and Commerce". Bringing together elites from the entire industry chain, the conference focused on MLED technology iteration and application expansion.
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- 2025-02-20
- Dr. Mu Fengwen, the founder of iSABers, will make an appearance at the 2025 6th Global Mini/Micro LED Display Technology Week.
Organized under the guidance of the China Video Industry Association (CVIA), hosted by the CVIA Mini/Micro LED Display Industry Branch (CMMA), co-hosted by Tianma Micro-Electronics Co., Ltd., and co-organized by the CVIA Intelligent Display & Vehicle Networking Branch, Micro LED Ecosystem Alliance, Xiamen University, Xiamen Future Display Technology Research Institute, and Xiamen Institute of Product Quality Supervision and Inspection, the 2025 6th Global Mini/Micro LED Display Technology Week 暨 CMMA Second Session First Member Conference will be held in Xiamen on February 27-28, 2025. With the theme "MLED Empowering Full Scenarios of Vehicle, Home, and Commerce", the event will bring together enterprises across the entire industry chain and industry elites to focus on the iterative development of the MLED industry chain and the trend of expanding application scenarios.
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- 2025-02-13
- iSABers' New Factory Commences Construction: Hybrid Bonding and C2W Technologies Lead Industrial Upgrades
On February 13, 2025, iSABers Group held a groundbreaking ceremony for its new factory at the Tianjin Binhai High-tech Zone Innovation and Entrepreneurship Park, marking a new chapter in the company’s large-scale development.
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- 2025-01-29
- Happy Chinese New Year | iSABers Wishes You a Prosperous Year of the Snake!
Thank you for your trust and support.
iSABers, together with all its employees, wishes you a happy Chinese New Year!
May you enjoy a joyous Spring Festival and a prosperous Year of the Snake!
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- 2025-01-24
- Annual Review | Stories Belonging to iSABers Team Members～
We are fortunate to have gathered at iSABers from all corners of the globe,
Accompanying each other and growing together.
United by the same dreams and missions,
We joined hands to weave many touching stories in 2024.
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- 2025-01-08
- iSABers News | iSABers Group Relocates to Tianjin, Unveiling a New Chapter of Development
At the dawn of the new year, iSABers has reached a significant milestone—the main headquarters has been relocated to Tianjin Binhai High-tech Zone, and the company has officially renamed to iSABers Semiconductor Technology (Group) Co., Ltd.
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- 2023-12-31
- iSABers | Embracing the Glory of 2024, Marching Toward the New Journey of 2025
Looking back on 2024, iSABers has written a new chapter in the bonding equipment and composite substrate material markets with remarkable achievements!
On March 26th, iSABers held an offline technological innovation sharing session themed "Pioneering the Future of Bonding, Innovating a New Landscape for the Industry" during the 2025 SEMICON China, which attracted extensive attention from the semiconductor industry. At the sharing session, iSABers fully demonstrated its latest breakthroughs in the field of high-end bonding equipment.
On March 25th, at the SEMICON International Conference on Heterogeneous Integration (Advanced Packaging), Dr. Mu Fengwen, Founder and Chairman of iSABers, delivered a keynote speech titled "Advanced Semiconductor Bonding Integration Technology: Innovation-Driven Application Breakthroughs and Industrial Upgrades". The speech showcased the latest breakthroughs by Chinese semiconductor enterprises in bonding technology to the global industry and deeply elaborated on how bonding technology has become a key force driving leapfrog development in the semiconductor industry.
On March 11th, iSABers held a grand new product launch event in Hong Kong, where the world’s first independently developed C2W&W2W Dual-Mode Hybrid Bonding Equipment SAB 82CWW Series made its stunning debut! The launch brought together top experts, scholars, and media from the semiconductor industry to witness the birth of this disruptive technology.
