Equipment Features
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- Full-Size Compatibility
- Supports polishing of samples across all sizes, including irregular shapes.
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- High-Reliability, Long-Lifetime Ion Source
- Proprietary ion source ensures stable energy output and long-term operational reliability.
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- High-Precision Motion Platform
- Precisely controls ion beam incidence position and angle via an advanced motion system.
Specifications and Parameters
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ltemsSpecification
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Wafer size2-12inch and irregular shapes
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Wafer loadManual
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TransmissionManual/Customized Tooling
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Removal efficiency60keV：800 Å*cm2/s@SiO2
20keV ：40 Å*cm2/s@SiO2 -
Process gasAr/SF6/O2/He or other mixed gases
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Beam intensity＞100μA @Ar
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Beam spot sizeFWHM<10mm
