When the wind is strong, it’s time to set sail and forge ahead. From October 12 to 14, the iSABers Project Management Elite Training Camp officially kicked off in Tianjin Binhai New Area. Dr. Mu Fengwen, Chairman of iSABers Group, led over 50 ISABers to participate, and the first phase of training has been completed.

Surprise activity - The top ten employees who answer the meaning of the custom pattern of the wooden carving lamp will receive a mysterious gift.

Dr. Mu Fengwen has long focused on the research and development of advanced heterogeneous integration technologies and equipment. He is proficient in the preparation of advanced compound semiconductor materials, low-cost device manufacturing, and the entire process of back-end packaging. As a national-level overseas high-level talent and a high-level talent from the Chinese Academy of Sciences (CAS) overseas program, Dr. Mu previously served as a researcher at the CAS Institute of Microelectronics.

Recently, the Tianjin Municipal Human Resources and Social Security Bureau released the Notice on the 2024 New Batch of Postdoctoral Research Workstation Branches, in which Tianjin Zhongke Jinghe Electronic Technology Co., Ltd. (hereinafter referred to as "Zhongke Jinghe"), a subsidiary of iSABers Group, was approved for inclusion.

Recently, iSABers, a leading Chinese enterprise in semiconductor material heterogeneous integration technology, announced a significant breakthrough in the preparation of silicon carbide on insulator (SiCOI) materials, successfully achieving mass production of high-quality wafer-level SiCOI (6-inch, SiC film thickness 1μm±100nm). This achievement not only marks a new height in iSABers’ R&D capabilities and technological innovation in semiconductor materials but also injects strong momentum into the development of China’s and the global semiconductor industry.

From August 7-9, 2024, the International Conference on Electronic Packaging Technology (ICEPT 2024) was held in Tianjin, China. Tianjin Zhongke Jinghe Electronics Technology Co., Ltd. (hereinafter referred to as "Zhongke Jinghe") served as a co-organizer and exhibitor at the event.

On August 3, 2024, the Tianjin "Jinchai Firefighting Accompanying Growth, Youth Building Dreams and Creating the Future" Hope Engineering Dream Practice Camp, donated by our company's love, officially opened. Guan Peng from our Strategic Planning and Policy Analysis Department attended the opening ceremony as a representative of the organizing unit. This activity aims to organize eligible students to cultivate their safety awareness and self-protection ability through the popularization and practical experience of fire safety knowledge.

Becoming a leader in the global semiconductor heterojunction integration field

Semiconductor heterogeneous integration technology enterprise iSABers Semiconductor Technology Co., Ltd. (hereinafter referred to as "iSABers" or "the Company") announced the completion of its latest round of financing

In today’s era of rapid global technological advancement, the importance of chips cannot be overstated. One of the core technologies supporting this progress is semiconductor substrate materials. As one of the few semiconductor companies globally to master the full suite of advanced semiconductor materials and heterogeneous integration technologies, iSABers has set a new benchmark in the field of composite semiconductor substrate materials.

As a leading enterprise in the field of semiconductor heterogeneous integration technology, iSABers Semiconductor Technology Co., Ltd. recently announced the successful development of an 8-inch Obsidian-Piezoelectric on Insulator (Obsidian-POI) substrate for high-performance filters. This achievement not only highlights iSABers’ profound expertise in advanced semiconductor material heterogeneous integration but also propels China’s technological capabilities in this field to the international forefront .

From April 24 to 26, 2024, the 4th Academic Conference on Heterogeneous Material Welding and Bonding, jointly organized by Harbin Institute of Technology and other institutions, was grandly held in Chongqing. Mr. Tan Xianghu, Deputy General Manager of Beijing iSABers Semiconductor Technology Co., Ltd., was invited to attend the conference and delivered an invited keynote speech titled "Advanced Semiconductor Bonding Integration Technology and Applications".