We are fortunate to have gathered at iSABers from all corners of the globe, Accompanying each other and growing together. United by the same dreams and missions, We joined hands to weave many touching stories in 2024.

At the dawn of the new year, iSABers has reached a significant milestone—the main headquarters has been relocated to Tianjin Binhai High-tech Zone, and the company has officially renamed to iSABers Semiconductor Technology (Group) Co., Ltd.

Looking back on 2024, iSABers has written a new chapter in the bonding equipment and composite substrate material markets with remarkable achievements!

Recently, iSABers Corporation, in deep collaboration with the High-Frequency and High-Voltage Center of the Institute of Microelectronics of the Chinese Academy of Sciences (CAS) and the Nanjing Electronic Devices Institute,

Recently, exciting news came to iSABers Group! The Office of the National High - tech Enterprise Certification Management Leading Group announced the Public Notice on the Filing of the Second Batch of High - tech Enterprises Recognized and Submitted for Filing by the Tianjin Certification Authority in 2024. Zhongke Jinghe, a subsidiary of iSABers Group, successfully passed the evaluation for the "High - tech Enterprise" certification with its outstanding performance! This good news marks that iSABers has made a new breakthrough on the road of scientific and technological innovation and has officially entered a new development stage.

From December 11 to 12, the "2024 HangjiaShuo Third-Generation Semiconductor Mid-Year Conference · Silicon Carbide & Gallium Nitride Industry Summit and Jiguang Award (Aurora Award) Ceremony," organized by HangjiaShuo, was grandly held in Shenzhen. iSABers was invited to participate and won the "Annual Enterprise – Third-Generation Semiconductor Investment Value Award".

Dear friends It's the annual turkey shivering festival again Qinghe Jingyuan sends out to everyone

Recently, the Tianjin Development · Talent Pioneers — Top Ten Annual Figures Award Ceremony was grandly held at Tianjin Media Grand Theater. The ceremony aimed to recognize outstanding talents who have made significant contributions across various industries in Tianjin. After layers of selection, Dr. Mu Fengwen, Founder and Chairman of iSABers, was awarded the title of "Top Ten Annual Development Figures in Tianjin" for his outstanding achievements in the semiconductor field and positive contributions to Tianjin's development. At the ceremony, President Jiang Yong of Tianjin University of Technology, as the award presenter, extended warm congratulations to Dr. Mu.

The 10th International Third Generation Semiconductor Forum (IFSW2024) and the 21st China International Semiconductor Lighting Forum (SSLCHINA2024) Advanced Semiconductor Technology Application Innovation Exhibition (CASTAS)

Dr. Mu Fengwen, founder and chairman of iSABers Group. Master's degree in Mechanical Engineering from Tsinghua University, PhD from the University of Tokyo, former researcher at the Institute of Microelectronics, Chinese Academy of Sciences, national level overseas high-level talent, and member of the Tsinghua Entrepreneurs Association.

On November 1, 2024, iSABers’ self-developed high-end wafer bonding equipment successfully passed customer acceptance and entered mass delivery phase.

iSABers Semiconductor Technology (Group) Co., Ltd. is a high-tech enterprise specializing in semiconductor bonding integration technology in China. Its core business covers R&D and manufacturing of high-end bonding equipment, as well as precision bonding process OEM services. The technologies are widely applied in cutting-edge fields such as advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration, and MEMS sensors. Through the dual-drive model of "equipment manufacturing + process services," the company builds full-industrial-chain solutions and has successfully developed four independent intellectual property product matrices: ultra-high vacuum room-temperature bonding systems, hybrid bonding equipment, thermocompression bonding equipment, and supporting process services. Through continuous technological innovation, iSABers is committed to providing the global semiconductor industry chain with high-precision, process-stable, and cost-effective bonding equipment and solutions to boost the rise of strategic emerging industries.