On May 19, 2023, the "Integrate Innovation, Break Boundaries" commissioning ceremony for iSABers’ Tianjin new bonding-integrated substrate mass production demonstration line was successfully held in Binhai High-Tech Zone! This milestone signifies China’s strategic breakthrough in the fiercely competitive global semiconductor market, carrying significant implications for promoting high-quality development of China’s semiconductor industry, filling domestic market gaps, and strengthening independent innovation capabilities. The event attracted leaders and experts from government, industry, academia, research, and investment sectors, who jointly witnessed this major industry occasion.

Attendees of Distinction
Lian Maojun: Alternate Member of the 20th Central Committee, Standing Committee Member of Tianjin Municipal Party Committee, and Secretary of Binhai New Area Party Committee
Hao Yue: Academician of the Chinese Academy of Sciences, Microelectronics and Solid-State Electronics Expert
Zhang Guihua: Vice District Mayor of Binhai New Area
Xia Qinglin: Secretary of the Party Committee and Director of the Management Committee of Binhai High-Tech Zone
Ji Gang: CTO of Shanghai Will Semiconductor Co., Ltd.
Liu Xinyu: Researcher at the Institute of Microelectronics, Chinese Academy of Sciences; Expert in National 01 Special Project and 6G Technology
Prof. Tadashi Suehiro: Distinguished Professor at the University of Tokyo
Prof. Zou Guisheng: Tenured Professor at Tsinghua University; Chairman of the Micro-Nano Bonding Division of the International Institute of Welding (IIW)
Qu Yang: General Manager of Tianjin Haihe Industrial Fund Management Co., Ltd.
Dr. Mu Fengwen: Chairman and General Manager of iSABers Group

Against the backdrop of global economic downturn and shifting trade dynamics, developed nations led by the U.S. have intensified pressure on China’s semiconductor industry, creating significant obstacles for domestic development. In this context, breaking through overseas technological blockades via independent innovation—particularly in "necklace" issues (critical bottlenecks) such as semiconductor equipment and materials—has become a top priority.

iSABers upholds its corporate spirit of "Integrate Innovation, Break Boundaries", independently developing advanced semiconductor material bonding integration technologies. These technologies have successfully entered mass production demonstration phases, enabling China’s semiconductor industry to transition from "technology import" to "independent R&D and production," and now to "large-scale manufacturing." This milestone propels China’s semiconductor capabilities to new heights. At the event, leaders from Tianjin Binhai New Area praised iSABers’ technological innovation in "necklace" material sectors and encouraged the company to continue deepening its industry contributions.

"The iSABers Tianjin composite substrate production line is China’s first mass production line for new-type composite substrates, featuring globally leading technical standards and filling a domestic industry gap. In recent years, the district has vigorously implemented a manufacturing-driven strategy, striving to become a core zone for advanced manufacturing and R&D. We have introduced a series of supportive policies to fully boost the development of the information technology and innovation (ITI) industry, creating an optimal environment for enterprises. We welcome iSABers to further increase investments in Binhai New Area, attract upstream and downstream enterprises to cluster here, and jointly promote high-quality industrial development."

Zhang Guihua, Deputy District Chief of Binhai New Area

Academician Hao Yue first expressed congratulations on the development of iSABers at the online event, and emphasized that "China's semiconductor materials industry has made great progress, and some technical fields even have a trend of parallel development with international peers. However, overall, China's semiconductor materials industry is large but not strong, and enterprises are more followers of homogeneous competition, which urgently needs to strengthen original innovation. Faced with the urgent requirements of China's current and long-term development, increasing the research and development of key core technologies is of paramount importance. iSABers adheres to the corporate spirit of" integrated innovation, breaking through boundaries ", independently develops and launches advanced semiconductor material bonding integration technology, and has achieved a phased breakthrough in the field of semiconductor composite substrate materials in China. The implementation and application of this technology in the production process will greatly increase the production capacity of high-quality products in the wide bandgap semiconductor field, driving the development of China's entire semiconductor industry and surrounding industries。

Hao Yue, Academician of the CAS Member, Microelectronics and Solid State Electronics

Ji Gang, CTO of Shanghai Weier Semiconductor Co., Ltd., congratulated iSABers on the smooth operation of the composite substrate production line, and pointed out that the third-generation semiconductor represented by SiC/GaN has become the development direction of power devices and the foundation of high-efficiency and energy-saving new energy industry. However, it also faces the situation of tight substrate supply and high costs, which seriously restricts the large-scale production of device products, especially the process of localization. iSABers's innovative substrate bonding and stripping technology provides the market with low-cost and high-performance substrate preparation capabilities, giving us confidence in developing domestic devices and providing strong solutions for Chinese power semiconductors. We hope to become a long-term strategic partner with iSABers.

Dr. Mu Fengwen, Chairman of iSABers, said, "Advanced semiconductor composite substrate technology is one of the most advanced wafer level heterogeneous integration technologies currently available, which can effectively solve the problems of limited performance, high cost, and low yield of single semiconductor materials. The launch of the new type of bonded integrated substrate mass production demonstration line marks the foundation for large-scale production of advanced semiconductor bonded integrated substrate products in China, further consolidating iSABers's leading position in this field. It is extremely important for iSABers's advanced bonded integrated substrate industry to occupy strategic high points globally. This is not only a grand event for iSABers, but also a happy event for the entire industry! We would like to thank all experts and partners for their recognition and support. The company will live up to high expectations and continue to... Together with everyone, contribute to the development of China's semiconductor industry. In the future, the company will further expand production capacity and reduce costs based on its leading technological advantages and mature mass production capabilities to meet the growing product demand of downstream customers.

Dr. Mu Fengwen, Chairman of iSABers

Focus on the long-term and grasp the overall trend! As a leading enterprise in the industry, iSABers will focus on national strategy, achieve breakthroughs in the core links of the industrial chain, provide market foundation and broad development space for industrial growth, connect the upstream and downstream of the industrial chain, and promote collaborative innovation.
After the completion of the online event, a forum with the theme of "Semiconductor Materials and Device Fusion Technology" was launched simultaneously on the same day. At the meeting, experts expressed their opinions and jointly discussed and analyzed the development status and importance of semiconductor materials and device fusion technology, and discussed the market changes and future directions of China's semiconductor industry from multiple dimensions.

iSABers Group was established in 2020, focusing on the research and development, production, and manufacturing of new semiconductor materials. Since 2020, it has successively invested in the establishment of iSABers (Jincheng) Semiconductor Materials Co., Ltd. and iSABers (Tianjin) Semiconductor Materials Co., Ltd.

The core team of the company is composed of domestic and foreign professor level experts and technical talents in fields such as market strategy. As a leading provider of heterogeneous integration technology and solutions, iSABers focuses on applications such as third-generation semiconductors, 3D integration, advanced packaging, and power module packaging. iSABers Group is one of the few semiconductor companies in the world that has mastered a complete set of advanced semiconductor substrate bonding and integration technologies. It is committed to industrializing the international cutting-edge semiconductor material fusion technology and has been widely recognized by many well-known industrial and social capital. Currently, it has completed multiple rounds of financing with a financing scale of over 600 million yuan, which has great potential to become a unicorn enterprise.

In the past three years since its establishment, iSABers has taken "integration" as its spiritual core, promoting and developing new material technology, and gradually eliminating China's advanced semiconductor materials from being a "weakness". Looking towards the future, iSABers will continue to promote independent technology research and development, and collaborative innovation to help the industry achieve high-quality development!