On February 13, 2025, iSABers Group held a groundbreaking ceremony for its new factory at the Tianjin Binhai High-tech Zone Innovation and Entrepreneurship Park, marking a new chapter in the company’s large-scale development.

Leaders from the Tianjin Binhai High-tech Zone attended the ceremony, highly commending iSABers’ past achievements and expressing full confidence in the company’s future growth.

Leaders from the Tianjin Binhai High-tech Zone attended the ceremony, highly commending iSABers’ past achievements and expressing full confidence in the company’s future growth.

As a leader in the semiconductor industry, iSABers has long specialized in advanced semiconductor bonding integration technologies. The company has achieved remarkable breakthroughs in hybrid bonding and C2W (Chip-to-Wafer) technologies. Its independently developed 12-inch C2W and W2W bonding equipment boasts an alignment accuracy of ±50nm and post-bonding precision exceeding ±100nm, performance comparable to international leading enterprises. These technologies not only enable inter-chip connectivity, significantly enhancing product integration and reliability but also support flexible, separate testing and screening of high-quality chips before bonding—reducing overall defect rates. Additionally, they facilitate heterogeneous integration, minimizing material waste and cutting costs.

In the future, iSABers will focus on key R&D of bonding equipment for 2.5D/3D advanced packaging and plans to launch more high-end products to meet evolving market demands.

Adhering to the spirit of innovation, pragmatism, and progress, iSABers will closely follow global semiconductor industry trends, continuously innovate to address diverse market needs, actively expand into foreign markets, strengthen cooperation with overseas clients, and introduce advanced technologies and products to the global stage. Meanwhile, the company will join hands with domestic semiconductor enterprises to jointly drive the rise and prosperity of China’s semiconductor industry.