On November 1, 2024, iSABers’ self-developed high-end wafer bonding equipment successfully passed customer acceptance and entered mass delivery phase.


Leveraging world-class semiconductor bonding technologies, iSABers has long been committed to accelerating the industrialization of homogeneous/heterogeneous material integration and chip homo/heterogeneous integration in semiconductor and related fields. The company has deep expertise in wafer-level heterogeneous material integration, advanced packaging, and ultra-precision processing, providing customers with high-end semiconductor equipment and integrated solutions widely applied in Chiplet integration, device fabrication (MEMS, RF, power devices), bonded substrate manufacturing, and display panel packaging.


Looking ahead, iSABers will continue to uphold a customer-centric philosophy, drive integrated innovation, and push technological boundaries. We look forward to collaborating with global partners to jointly create a brilliant chapter in the field of semiconductor heterogeneous integration and contribute more iSABers wisdom and strength to the vigorous development of the semiconductor industry.