From August 7-9, 2024, the International Conference on Electronic Packaging Technology (ICEPT 2024) was held in Tianjin, China. Tianjin Zhongke Jinghe Electronics Technology Co., Ltd. (hereinafter referred to as "Zhongke Jinghe") served as a co-organizer and exhibitor at the event.

As a globally top-tier conference in electronic packaging technology, ICEPT is strongly supported by IEEE-EPS (IEEE Electronic Packaging Society) and highly regarded by the Chinese Institute of Electronics (CIE) and the China Association for Science and Technology (CAST). It is recognized as one of the four leading international conferences in the electronic packaging field. ICEPT 2024 focused on showcasing semiconductor packaging and testing technologies, while creating a one-stop platform for procurement and technical exchanges. Over 1,000 experts, scholars, and industry professionals from nearly 20 countries and regions participated in the event. 

As a co-organizer, Zhongke Jinghe actively engaged with industry professionals to discuss advanced packaging technologies and industry trends. The company aimed to accelerate the industrialization of semiconductor packaging and testing technologies and shape the future of the packaging technology industry. Through its exhibition, Zhongke Jinghe highlighted its expertise in wafer-level heterogeneous integration, advanced packaging, and ultra-precision processing, demonstrating its commitment to advancing technological innovation in the sector.

(Photo: Zhongke Jinghe’s booth at ICEPT 2024 on August 9)

Looking ahead, Zhongke Jinghe remains committed to its customer-centric philosophy and a "striver-oriented" culture. The company will continue to focus on enhancing core technologies, positioning itself as a provider of advanced bonding solutions. By developing cutting-edge packaging equipment that meets global standards and future demands, Zhongke Jinghe aims to become a leader in the global heterogeneous integration field.