Hosted by Beijing iSABers Semiconductor Technology Co., Ltd., the "Interconnection Technology Symposium" will take place in Tianjin Binhai New Area on May 17. The forum aims to strengthen exchanges in semiconductor interconnection technologies and promote leapfrog breakthroughs in domestic semiconductor technology.

At that time, top experts in the field of microelectronic packaging integration, outstanding professors at the University of Tokyo, former president of the Japan Electronics Packaging Society, and chief scientist of iSABers, Professor Keiichi Suga, will be invited; Professor Wang Chenxi, Professor of Harbin Institute of Technology, Senior member of IEEE, and Chairman of ICTA Packaging Subcommittee; Professor Wu Xin, Associate Professor at Sun Yat sen University and recipient of the A.F. Davis Silver Medal Award from the American Welding Society; Researcher Cheng Zhe, doctoral supervisor at Peking University; Dr. Mu Fengwen, Chairman of Beijing Qinghe Jingyuan Semiconductor Technology Co., Ltd., and other experts and scholars gathered together to give a keynote speech.