Semiconductor bonding technology is driving revolutionary advancements in 3D integration and advanced packaging! As an innovation leader in low-temperature bonding and bonding integration, iSABers has joined forces with international authoritative institutions such as the Institute for Microsystems Integration (IMSI) of Japan to co-host the 2025 China International Low-Temperature Bonding and 3D Integration Technology Seminar (LTB-3D 2025). This globally top-tier academic conference will make its debut in China, bringing together numerous international giants and global experts to explore the frontiers of wafer bonding technology and its industrial applications.

LTB-3D 2025 will focus on core technologies such as low-temperature bonding, heterogeneous integration, and advanced packaging, providing a globally aligned communication platform for China's semiconductor industry. iSABers sincerely invites colleagues from academia and industry to join this grand event and accelerate technological innovation and industrial chain collaboration!