设备特点
规格参数
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ItemsSpecification
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Sample sizeOption 1: 0.4*0.4-32*32 mm
Option 2: 0.4*0.4-50*50 mm
(Customizable up to 100 × 100 mm) -
Bonding force range1-3000N
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Pressure stability1-50N, Accuracy ≤ ±0.5N
51-3000N, Accuracy ≤ ±2N -
Post-bonding accuracy≤±1μm; ≤±500nm; ≤±300nm
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Bonder temperatureRT~450℃
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Bonder stability±0.5℃
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Bonder heating rate (RT-450) ℃)6s@52*52mm; 2.2s@32*32mm
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Cooling methodGas cooling
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Chamber atmosphereInert atmosphere, Hydrogen radical (with vacuum system)
