The SAB8210CWW is a fully automated dual modes hybrid bonding system integrating C2W (chip-to-wafer) and W2W (wafer-to-wafer). It supports 8/12-inch wafers and handles 35 μm ultra-thin chips with multi-sizes. The system enables parallel development and validation of C2W and W2W processes, significantly shortening the R&D-to-production transition timeline.