设备特点
规格参数
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ItemsSpecification
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TF loadport2
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FOUP loadport2
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Bonding force rangeMax 30N
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Post-bonding accuracy≤±500 nm@ Inter-chip coaxial alignment
≤±200 nm@ Infrared transmissive alignment -
Chip size5*8 mm—32*32 mm
1*1 mm—32*32 mm -
Wafer size8/12 inch
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UPHSingle bonding head: >800@200 nm@3σ
Single bonding head: >400@50 nm@3σ -
ProcessCu/SiO₂ hybrid bonding, Cu/SiCN hybrid bonding
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Multi-module integratedActivation, clean, UV debond, chip pick and place, alignment, bonding, and detection
