The SAB6300 is a versatile, semi-automatic bonding system for R&D and small-batch production. It supports thermocompression bonding and anodic bonding, enabling diffusion bonding of metals (Au, Cu, Al, etc.), eutectic materials (Au-Sn, Al-Ge, etc.), or adhesives through precise temperature and pressure control. It also achieves glass-to-silicon bonding via electrostatic field combined with heating and pressurization.